Bill of Material for D:\PROJECTS 2025\IC-705_BT_TTGO_\XPA-125\V3.Sch This BOM is to suit IC-705 Bluetooth band decoder PCB, V3 101125 Dec 2025 VK3PE Used Part Type Designator Footprint Description ==== ===================== ==================== ========== ========================================== 2 100K R11 R24 1206-0805 4 100nF C3 C4 C6 C7 1206-0805 1 100R R5 1206-0805 12 10K R1 R10 R13 R14 R15 1206-0805 R2 R3 R4 R6 R7 R8 R9 2 10k R14, R15 NOTE< MISSING on V3 PCB ! 2 1N400x D1 D2 AXIAL0.4 any 1N00 series diode (axial) 1 1uF/10V C2 RB.1/.2 polarized cap 1 22uF C5 CAP_6X6 polarized cap SMD type 5 2N7000 Q1 Q2 Q3 Q4 Q5 SOT-23-123 smd FET 1 47K R12 1206-0805 1 47uF/25V C1 RB.1/.2 polarized cap 1 LM7805T U3 TO-220 1 Heatsink W273 type NOTE requires minor mod to fit on PCB 1 m3 x 10 nut & bolt for heatsink. 1 BSS84 Q22 SOT-23-123 1 ESP32 TTGO U2 DIP24-W ESP32 TTGO module 1 HEADER 4 J4 SIP4 Header male 0.1" pitch 2 HEADER 10 J5 J6 SIP10 Header, 10-Pin 4 HEADER 2 J1 J2 J3 J9 SIP2 J2 is optional, not used. 1 Header-female 2 pin for power input on J1 1 HEADER 3 J7 SIP3 1 HEADER 8 J8 sip8 Header female to suit above connectors for bands out etc etc. 1 LMC662 U6 DIP8 optional for Analog "band' output 1 MCP23017-E/SO U1 SOIC-28 1 MOSFET P NDT452AP Q22A SOT-223 alternate to Q22 2 ULN2803A (DIP18) U4 U5 DIP18 HIGH-VOLTAGE,HIGH-CURRENT DARLINGTON ARRAYS MISC 1 ILI9341 type TFT display 2.8" See pictures. 2 spacers tapped 3mm, 10mm long. May require additional spacers to mount this assembly to front panel. M3 metal threads (bolts)and nuts as required. NOT INCLUDED wire to connect to the external PTT out and bands decodes.